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    Items for Author "Wang,SJ" 

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    Showing 17 items.

    Collection Date Title Authors Bitstream
    [化學工程與材料工程研究所] 期刊論文 2009 Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions Yen,YW; Tseng,HW; Zeng,K; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 1993 ROBUST FEEDBACK DESIGN FOR NONLINEAR HIGH-PURITY DISTILLATION COLUMN CONTROL WANG,SJ; YU,SW
    [化學工程與材料工程研究所] 期刊論文 1992 IMPROVED DMC DESIGN FOR NONLINEAR PROCESS-CONTROL CHANG,CM; WANG,SJ; YU,SW
    [材料科學與工程研究所 ] 期刊論文 2005 High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure Lin,CL; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2007 Electromigration-induced Kirkendall voids at the Cu/Cu3Sn interface in flip-chip Cu/Sn/Cu joints Liu,CY; Chen,JT; Chuang,YC; Ke,L; Wang,SJ
    [化學工程與材料工程研究所] 期刊論文 2004 An effective Cu-Sn barrier layer for Au bump used in optoelectronic devices Liu,CY; Wang,SJ
    [化學工程與材料工程研究所] 期刊論文 2004 Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps Wang,SJ; Kao,HJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2003 Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization Hsu,SC; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2003 Electromigration studies on Sn(Cu) alloy lines Lu,CC; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2003 Prevention of spalling by the self-formed reaction barrier layer on controlled collapse chip connections under bump metallization Liu,CY; Wang,SJ
    [化學工程與材料工程研究所] 期刊論文 2003 Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2003 Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure Wang,SJ; Liu,CY
    [光電科學與工程學系] 期刊論文 2005 Light-emitting diodes with nickel substrates fabricated by electroplating Chang,PH; Chen,NC; Wang,YN; Shih,CF; Wu,MH; Yang,TH; Tzou,YH; Wang,SJ
    [數據分析方法研究中心 ] 期刊論文 2011 Temporal Associations between Weather and Headache: Analysis by Empirical Mode Decomposition Yang,AC; Fuh,JL; Huang,NE; Shia,BC; Peng,CK; Wang,SJ
    [資訊工程學系] 期刊論文 2011 A novel data hiding and reversible scheme using SMN blocks in VQ-compressed images Huang,CT; Wang,WJ; Wang,SJ
    [資訊工程學系] 期刊論文 2011 Reversible steganography based on side match and hit pattern for VQ-compressed images Yang,CH; Wang,WJ; Huang,CT; Wang,SJ
    [資訊工程學系] 期刊論文 2011 VQ Applications in Steganographic Data Hiding Upon Multimedia Images Wang,WJ; Huang,CT; Wang,SJ

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