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Items for Author "WANG,SJ"
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Showing 17 items.
Collection
Date
Title
Authors
Bitstream
[化學工程與材料工程研究所] 期刊論文
2004
An effective Cu-Sn barrier layer for Au bump used in optoelectronic devices
Liu,CY
;
Wang,SJ
[資訊工程學系] 期刊論文
2011
A novel data hiding and reversible scheme using SMN blocks in VQ-compressed images
Huang,CT
;
Wang,WJ
;
Wang,SJ
[化學工程與材料工程研究所] 期刊論文
2004
Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps
Wang,SJ
;
Kao,HJ
;
Liu,CY
[化學工程與材料工程研究所] 期刊論文
2009
Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions
Yen,YW
;
Tseng,HW
;
Zeng,K
;
Wang,SJ
;
Liu,CY
[化學工程與材料工程研究所] 期刊論文
2003
Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization
Hsu,SC
;
Wang,SJ
;
Liu,CY
[化學工程與材料工程研究所] 期刊論文
2007
Electromigration-induced Kirkendall voids at the Cu/Cu3Sn interface in flip-chip Cu/Sn/Cu joints
Liu,CY
;
Chen,JT
;
Chuang,YC
;
Ke,L
;
Wang,SJ
[化學工程與材料工程研究所] 期刊論文
2003
Electromigration studies on Sn(Cu) alloy lines
Lu,CC
;
Wang,SJ
;
Liu,CY
[材料科學與工程研究所 ] 期刊論文
2005
High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure
Lin,CL
;
Wang,SJ
;
Liu,CY
[化學工程與材料工程研究所] 期刊論文
1992
IMPROVED DMC DESIGN FOR NONLINEAR PROCESS-CONTROL
CHANG,CM
;
WANG,SJ
;
YU,SW
[光電科學與工程學系] 期刊論文
2005
Light-emitting diodes with nickel substrates fabricated by electroplating
Chang,PH
;
Chen,NC
;
Wang,YN
;
Shih,CF
;
Wu,MH
;
Yang,TH
;
Tzou,YH
;
Wang,SJ
[化學工程與材料工程研究所] 期刊論文
2003
Prevention of spalling by the self-formed reaction barrier layer on controlled collapse chip connections under bump metallization
Liu,CY
;
Wang,SJ
[化學工程與材料工程研究所] 期刊論文
2003
Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders
Wang,SJ
;
Liu,CY
[資訊工程學系] 期刊論文
2011
Reversible steganography based on side match and hit pattern for VQ-compressed images
Yang,CH
;
Wang,WJ
;
Huang,CT
;
Wang,SJ
[化學工程與材料工程研究所] 期刊論文
1993
ROBUST FEEDBACK DESIGN FOR NONLINEAR HIGH-PURITY DISTILLATION COLUMN CONTROL
WANG,SJ
;
YU,SW
[化學工程與材料工程研究所] 期刊論文
2003
Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure
Wang,SJ
;
Liu,CY
[數據分析方法研究中心 ] 期刊論文
2011
Temporal Associations between Weather and Headache: Analysis by Empirical Mode Decomposition
Yang,AC
;
Fuh,JL
;
Huang,NE
;
Shia,BC
;
Peng,CK
;
Wang,SJ
[資訊工程學系] 期刊論文
2011
VQ Applications in Steganographic Data Hiding Upon Multimedia Images
Wang,WJ
;
Huang,CT
;
Wang,SJ
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