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    DateTitleAuthors
    2005 Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR
    2005 The effect of silver content on the precipitation of the Al-4.6Cu-0.3Mg alloy Chang,CH; Lee,SL; Lin,JC; Jeng,RR

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