中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Items for Author

中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Items for Author

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Items for Author "Wu,AT"

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Showing 14 items.

Collection	Date	Title	Authors	Bitstream
[材料科學與工程研究所 ] 期刊論文	2010	Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder	Chiang,YY; Cheng,R; Wu,AT
[化學工程與材料工程學系 ] 期刊論文	2011	Controlled positions and kinetic analysis of spontaneous tin whisker growth	Su,CH; Chen,H; Lee,HY; Wu,AT
[化學工程與材料工程學系 ] 期刊論文	2011	Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits	Hsu,HH; Huang,SY; Chang,TC; Wu,AT
[化學工程與材料工程學系 ] 期刊論文	2011	Preferred orientation relationships with large misfit interfaces between Ni(3)Sn(4) and Ni in reactive wetting of eutectic SnPb on Ni	Suh,JO; Tu,KN; Wu,AT; Tamura,N
[化學工程與材料工程學系 ] 期刊論文	2011	Scratch-resistant zeolite anti-reflective coating on glass for solar applications	Chen,CH; Li,SY; Chiang,AST; Wu,AT; Sun,YS
[化學工程與材料工程學系 ] 期刊論文	2010	In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray	Wu,AT; Siao,CN; Ku,CS; Lee,HY
[化學工程與材料工程研究所] 期刊論文	2009	Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration	Wu,AT; Sun,KH
[化學工程與材料工程研究所] 期刊論文	2009	Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates	Wu,AT; Chen,MH; Huang,CH
[化學工程與材料工程研究所] 期刊論文	2009	In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays	Wu,AT; Tsai,CY; Kao,CL; Shih,MK; Lai,YS; Lee,HY; Ku,CS
[化學工程與材料工程研究所] 期刊論文	2009	In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays (vol 38, pg 2308, 2009)	Wu,AT; Tsai,CY; Kao,CL; Shih,MK; Lai,YS; Lee,HY; Ku,CS
[化學工程與材料工程研究所] 期刊論文	2009	The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates	Wu,AT; Chen,MH; Siao,CN
[化學工程與材料工程研究所] 期刊論文	2009	The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment	Wu,AT; Ding,YC
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration-induced grain rotation in anisotropic conducting beta tin	Wu,AT; Gusak,AM; Tu,KN; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2004	Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction	Wu,AT; Tu,KN; Lloyd,JR; Tamura,N; Valek,BC; Kao,CR

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