中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Items for Author

中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Items for Author

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Items for Author "Tseng,HW"

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Showing 12 items.

Collection	Date	Title	Authors	Bitstream
[通訊工程學系] 期刊論文	2011	Rotational Listening Strategy for IEEE 802.15.4 Wireless Body Networks	Tseng,HW; Sheu,ST; Shih,YY
[地球物理研究所] 期刊論文	1992	TOPOGRAPHIC RESPONSES IN MAGNETOMETRIC RESISTIVITY MODELING	YANG,CH; TSENG,HW
[化學工程與材料工程學系 ] 期刊論文	2011	Abnormal Cu(3)Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates	Huang,TS; Tseng,HW; Hsiao,YH; Cheng,CH; Lu,CT; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces	Tseng,HW; Lu,CT; Hsiao,YH; Liao,PL; Chuang,YC; Chung,TY; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Growth Mechanism of a Ternary (Cu,Ni)(6)Sn(5) Compound at the Sn(Cu)/Ni(P) Interface	Huang,TS; Tseng,HW; Lu,CT; Hsiao,YH; Chuang,YC; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer	Lu,CT; Tseng,HW; Chang,CH; Huang,TS; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers	Huang,KC; Shieu,FS; Huang,TS; Lu,CT; Chen,CW; Tseng,HW; Cheng,SL; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure	Liu,CY; Tseng,HW; Song,JM
[化學工程與材料工程研究所] 期刊論文	2009	Ag Electromigration Against Electron Flow in Sn5Ag/Cu Solder Bump	Tseng,HW; Yeh,YT; Lin,KY; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions	Yen,YW; Tseng,HW; Zeng,K; Wang,SJ; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders	Hsiao,YH; Tseng,HW; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys	Lee,YY; Tseng,HW; Hsiao,YH; Liu,CY

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