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    "Wu,AT"的相關文件 

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    顯示 14 項.

    類別 日期 題名 作者 檔案
    [化學工程與材料工程研究所] 期刊論文 2009 The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment Wu,AT; Ding,YC
    [化學工程與材料工程研究所] 期刊論文 2009 The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates Wu,AT; Chen,MH; Siao,CN
    [化學工程與材料工程學系 ] 期刊論文 2011 Scratch-resistant zeolite anti-reflective coating on glass for solar applications Chen,CH; Li,SY; Chiang,AST; Wu,AT; Sun,YS
    [化學工程與材料工程學系 ] 期刊論文 2011 Preferred orientation relationships with large misfit interfaces between Ni(3)Sn(4) and Ni in reactive wetting of eutectic SnPb on Ni Suh,JO; Tu,KN; Wu,AT; Tamura,N
    [化學工程與材料工程學系 ] 期刊論文 2011 Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits Hsu,HH; Huang,SY; Chang,TC; Wu,AT
    [化學工程與材料工程學系 ] 期刊論文 2010 In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray Wu,AT; Siao,CN; Ku,CS; Lee,HY
    [化學工程與材料工程研究所] 期刊論文 2009 In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays (vol 38, pg 2308, 2009) Wu,AT; Tsai,CY; Kao,CL; Shih,MK; Lai,YS; Lee,HY; Ku,CS
    [化學工程與材料工程研究所] 期刊論文 2009 In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays Wu,AT; Tsai,CY; Kao,CL; Shih,MK; Lai,YS; Lee,HY; Ku,CS
    [化學工程與材料工程研究所] 期刊論文 2009 Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates Wu,AT; Chen,MH; Huang,CH
    [化學工程與材料工程研究所] 期刊論文 2004 Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction Wu,AT; Tu,KN; Lloyd,JR; Tamura,N; Valek,BC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration-induced grain rotation in anisotropic conducting beta tin Wu,AT; Gusak,AM; Tu,KN; Kao,CR
    [材料科學與工程研究所 ] 期刊論文 2010 Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder Chiang,YY; Cheng,R; Wu,AT
    [化學工程與材料工程研究所] 期刊論文 2009 Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration Wu,AT; Sun,KH
    [化學工程與材料工程學系 ] 期刊論文 2011 Controlled positions and kinetic analysis of spontaneous tin whisker growth Su,CH; Chen,H; Lee,HY; Wu,AT

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