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Date	Title	Authors
2010-07-19	電調變液晶波導; Electrically Tunable Liquid Crystal Waveguides	粘珊綺; Shan-Chi Nien
2013-04-30	電路印刷板產業以平衡計分卡方法之準交率改善研究	李珈育; Lee,Chia-yu
2020-12-03	電路板拉焊製程參數優化與 烙鐵頭剩餘使用壽命預測之研究;Achieving Optimum Process Parameters and Prediction of Remaining Useful Life of Soldering Tip for Drag Soldering of Printed Circuit Board	陳思羽; Chen, Sz-Yu
2009-01-06	電路板機構設計與電子設計之資料交換模式探討	鍾添良; Tien-Liang Chung
2011-07-03	電路板產業存貨改善研究-以N公司為例; Inventory improvement research of PCB industry - By N corporation	張峰銘; Feng-Ming Chang
2018-07-30	電路板製程電鍍金槽降低金鹽用量之研究;Study on the Electroplating Gold Tanks to Reduce the Amount of Gold Salt in Circuit Board Process	陳建維; Chen, Chien-Wei
1995-09-01	電路模擬性能提升之研究;Performance Improvement of Circuit Simulation	蔡曜聰
2009-03-26	電遷移對純錫導線晶粒旋轉之研究; Grain Rotation Induced by Electromigration in Pure Tin Strip	謝育忠; YU-CHUNG HSIEH
2006-07-01	電遷移對覆晶元件銲點之影響(I); The Effects of Electromigration on Flip-Chip Solder Joints(I)	高振宏
2005-06-16	電遷移對銅原子在熔融錫鉛銲料中擴散行為之影響; The diffusion of Cu in the molten eutectic Sn-pb solder with electromigration	蘇皇維; Huamg-Wei Su
2005-06-16	電遷移對銅於液態銲錫中的溶解速率之影響; The dissolution rate of copper in the molten solder with current stressing	黃建融; Chien-Zong Huang
2006-06-21	電遷移對錫鬚晶生長行為之影響	林育蔚; Yu-Wei Lin
2008-06-19	電遷移效應對Sn5Ag/Cu界面反應的影響; Current density effect on the interfacial reaction between Sn5Ag/Cu	葉昱廷; Yu-ting Yeh
2002-06-27	電遷移效應對錫微結構影響之探討; Electromigration effect on the microstructure of Tin foil	王祥文; Hisang-Wen Wang
2013-06-18	電遷移誘發銅基材於純錫銲料及錫銀銲料中消耗探討	陳佳鈺; Chen,Chia-yu
2004-06-23	電遷移誘發銅墊層消耗動力學之研究; Study of Cu dissolution induced by Electromigration	戈鈴; Lin Ke
2010-12-23	電遷移誘發錫/銅界面(錫,銅)原子通量之交互關係及其對錫/銅銲點電遷移失效機制影響研究; Study of interaction between electromigration-induced (Sn,Cu) atomic fluxes at Sn/Cu interface and the effect on EM-induced failure modes at Sn/Cu joint interface	曾華偉; Hua-wei Tseng
2013-06-18	電遷移誘發錫原子逆迴流通量與錫自身電遷移通量 於陰極銅/錫界面原子通量交互關係之研究; Study of interaction between electromigration-induced Sn back-filled atomic fluxes and Sn EM flux on EM-induced failure modes at Sn/Cu joint interface	呂承澤; Lu,Cheng-Tse
2023-06-28	電鍍(111)奈米雙晶銅在不同應力模式下的塑性變形機制研究;Plastic deformation mechanism of nano-twinned Cu under different stress model	李稼鴻; Lee, Chia-Hung
2010-07-28	電鍍法製備準直排列ZnO; 奈米結構陣列及其特性之研究 Fabrication of large-area vertically aligned ZnO nanostructure arrays by electrodeposition and their properties.	葉秉昀; Ping-Yun Yeh
2019-08-20	電鍍製作銅錫合金及Cu6Sn5之三維奈米晶微結構及其特性研究;Three-dimensional micro features of copper-tin alloy with Cu6Sn5 in Nanocrystals prepared by electroplating and their characterization	林佳政; Lin, Chia-Cheng
2015-07-16	電鍍製程含硫酸亞錫廢水再利用方法之研究;Investigation of Stannous Sulfate Wastewater Recycling in Electroplating Process	黃尹廷; Huang,Ying-ting
2007-07-04	電阻串數位類比轉換器之類比多工器設計; Design of Analog Multiplexer in a Resistor-String DAC	陳保霖; Bao-Lin Chen
2007-07-04	電阻串聯式連續參考值產生器的佈局; Layout of a Resistor-String Successive Reference Generator	莊勝富; Sheng-fu juang
2015-08-13	電阻串連式連續參考值產生器於製程設計套件之評量;Qualification of the Resistor-String Successive Reference Generator for Process Design Kit	林昭淇; Lin,Chao-Chi

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