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日期	題名	作者
2011-08-22	銅、鎂含量與熱處理對Al-14.5Si-Cu-Mg合金拉伸、熱穩定與磨耗性質之影響; Effects of Cu, Mg contents and heat treatment on tensile, thermal stability and wear properties of Al-14.5Si-Cu-Mg alloys	吳志庭; Chih-Ting Wu
2009-07-23	銅、鎳微柱之機械性質與其在3.5 wt% NaCl 溶液中之腐蝕行為; Mechanical property of the micrometer Cu- and Ni- pillars and their corrosion in 3.5 wt% NaCl solution	黃振峰; Chen-feng Huang
2017-07-28	銅二級冶煉爐渣資源化之研究;Research on the Resource of Copper Secondary Smelting Slag	劉秉政; Liu, Ping-Cheng
2016-07-29	銅催化之碳氫鍵芳香環化反應於染料敏化太陽能電池之綠色合成與應用;Step- and Cost-Effective Synthesis of D-π-A Organic Sensitizers via Cu-Catalyzed Direct Arylations: Development of Sn- & Pd-Free Process for Dye-Sensitized Solar Cells	黃泂淮; Huang,Jiung-Huai
2012-07-12	銅催化碳硫偶合反應之陽離子效應研究;The cation effect of copper catalyzed C-S coupling study	張原銘; Chang,Yuan-ming
2008-06-19	銅基材晶粒尺寸與優選方向對錫銅銲料反應之影響; Effect of Cu substrate grain size and orientation on Sn/Cu soldering reaction	黃咨鳴; Tzu-ming Huang
2024-08-20	銅基板殘留應力對銅接點性質影響之研究;Effect of Residual Stress in Cu Substrate on Joint Properties for Cu-to-Cu Bonding	王虹; Wang, Hung
2024-01-22	銅基板特性對低壓化學氣相沉積生長 六方氮化硼之影響;Effects of copper substrate characteristics on hexagonal boron nitride growth by Low Pressure Chemical Vapor deposition	李建裕; Li, Jian-Yu
2018-07-23	銅基金屬輔助蝕刻製作半導體奈米結構及光致發光效應;Forming semiconductor nanostructures with photoluminescence by copper-based metal-assisted etching	辜偉豪; Ku, Wei-Hao
2013-06-27	銅奈米微粒隨氧化程度對自旋極化的影響	苟穎書; Kou,Ying-shu
2018-06-21	銅對二氧化鈦光觸媒之光催化活性及抗菌性影響;Photocatalytic activity and antibacterial effectiveness on copper-doped titanium dioxide	商君雅; Shang, Jun-Ya
2002-07-10	銅導線上鍍金或鎳/金對遷移性之影響及鍍金層對Sn-0.7Cu與In-48Sn BGA銲料迴銲後之接點強度影響 ;Effect of Au and Ni/Au coatings on the electrolytic migration of Cu-conductors, and effect of Au coatings on joint strength of BGA for Sn-0.7Cu and In-48Sn solder after reflow	張顧耀; Guh-Yaw Jang
2001-07-12	銅導線上鍍鎳或錫對遷移性之影響及鍍金之鎳/銅銲墊與Sn-3.5Ag BGA銲料迴銲之金脆研究 ;Effect of Ni and Sn coating on the electrolytic migration of Cu-conductors, and the study of gold-embrittlement induced by reflow of the Sn-3.5Ag BGA solder on the gold-deposited Ni/Cu pads	魏大華; Da-Hua Wei
2012-07-17	銅微柱表面之電化學析鍍氧化鋅奈米結構研究;Electrochemical deposition of ZnO nano structures on a copper micro-column	曾耀田; Tseng,Yao-Tien
2024-07-12	銅情緒指標對鐵礦砂期貨價格是否具有預測能力	趙于萱; Chao, Yu-Hsuan
2020-08-20	銅擴散在銀(鋅/錫)與受壓力鈀薄膜之研究;Cu diffusion in Ag(Zn, Sn) and stressed Pd thin films	林而儒; Lin, Erh-Ju
2014-07-17	銅氧化物奈米顆粒中一價銅對磁化強度的影響;Effects of Copper(II) oxide nano particle on magnatization.	林正鈞; Lin,Cheng-Chun
2008-06-20	銅氧核殼奈米顆粒的雙分量自旋極化; Tow-components spin polarization in Cu/O core-shell nanoparticles	李宗儒; Zong-Ru Li
2008-06-20	銅氧核殼奈米顆粒間交互作用對自旋極化之影響; Effects of interparticle interaction on spin-polarized Cu/O core-shell nanoparticles	陳乃維; Nai-Wei Chen
2020-08-24	銅污泥處理程序之戴奧辛類化合物與多環芳香烴排放特性探討;Characteristics of Dioxin-like Compounds and Polycyclic Aromatic Hydrocarbons Emitted from Copper-containing Sludge Treatment Process	方子翌; Fang, Tzu-Yi
2020-06-09	銅添加及氫化物形成於鈀銅雙金屬觸媒析氫反應效能影響之研究;The Effect of Cu Addition and Hydride Formation on the Hydrogen Evolution Reaction Performance of PdCu Bimetallic Catalysts	林萱; Lin, Shuan
2014-08-13	銅片上電化學法披覆摻銀氧化鋅奈米柱結構並探討特性;Electrochemical coating of Ag-doped ZnO nanorods on copper plate to study their structure and charatcterization	李國志; Li,Guo-jhih
2007-05-31	銅的蝕刻與保護行為之研究; Study of copper etching and protection	張程皓; Cheng-Hao Jhang
2014-07-04	銅箔在液態Sn-0.3Ag-0.7Cu銲料中的固溶研究;Dissolution of copper foil contact with liquid Sn-0.3Ag-0.7Cu solder	簡信方; Chien,Hsin-fang
2008-06-19	銅箔基板在H2O2/H2SO4溶液中之微蝕行為; The micro-etching work of copper substrate in a mixed solution of hydrogen peroxide and sulfuric acid	鐘榮芳; Jung-fang Chung

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