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    Research Project [184/184]
    Electronic Thesis & Dissertation [400/400]

    Collection Statistics

    近3年内发表的文件: 0(0.00%)
    含全文笔数: 118(100.00%)

    文件下载次数统计
    下载大于0次: 118(100.00%)
    下载大于100次: 118(100.00%)
    全文下载总次数: 83985(21.62%)

    最后更新时间: 2025-12-23 23:48


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    Showing items 101-110 of 118. (12 Page(s) Totally)
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    DateTitleAuthors
    2006 Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder Lin CK,Huang CM
    2006 Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR
    2006 Fabrication of periodic nickel silicide nanodot arrays using nanosphere lithography Cheng SL,Lu SW,Li CH,Chang YC,Huang CK,Chen H
    2006 Local melting induced by electromigration in flip-chip solder joints Tsai CM,Lin YL,Tsai JY,Lai YS,Kao CR
    2006 Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates Tsai JY,Chang CW,Ho CE,Lin YL,Kao CR
    2006 Polymorph farming of Acetaminophen and Sulfathiazole on a chip Lee,Tu; Hung,Shi Ting; Kuo,Chung Shin
    2006 Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer Hsiao YH,Chuang YC,Liu CY
    2006 Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps Liu,C. Y.; Ke,Lin; Chuang,Y. C.; Wang,S. J.
    2006 Study of wetting reaction between eutectic AuSn and Au foil Lai YT,Liu CY
    2006 Thermomigration in eutectic SnPb alloy Chuang YC,Liu CY

    Showing items 101-110 of 118. (12 Page(s) Totally)
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