English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 80990/80990 (100%)
造訪人次 : 41660295      線上人數 : 1826
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜尋範圍 查詢小技巧：
  • 您可在西文檢索詞彙前後加上"雙引號"，以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋，建議至進階搜尋限定作者欄位，可獲得較完整資料
    •  進階搜尋

    類別瀏覽

    正在載入社群分類, 請稍候....

    年代瀏覽

    正在載入年代分類, 請稍候....

    "Ho,CE"的相關文件 

    回到依作者瀏覽

    顯示 17 項.

    類別 日期 題名 作者 檔案
    [材料科學與工程研究所 ] 期刊論文 2005 Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints Lin,YL; Luo,WC; Lin,YH; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Chemical reaction in solder joints of microelectronic packages Ho,CE; Lin,YL; Tsai,JY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders Chen,WT; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni Ho,CE; Tsai,RY; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints Ho,CE; Shiau,LC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages Shiau,LC; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni Ho,CE; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Interactions between solder and metallization during long-term aging of advanced microelectronic packages Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering Ho,CE; Tsai,SY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish Liu,CM; Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Selective interfacial reaction between Ni and eutectic BiSn lead-free solder Tao,WH; Chen,C; Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Formation and resettlement of (AuxNi1-x)Sn-4 in solder joints of ball-grid-array packages with the Au/Ni surface finish Ho,CE; Zheng,R; Luo,GL; Lin,AH; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate Chen,C; Ho,CE; Lin,AH; Luo,GL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Optimizing the wire-bonding parameters for second bonds in ball grid array packages Ho,CE; Chen,C; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system Jain,TA; Huang,CG; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering Ho,CE; Chen,YM; Kao,CR

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期：8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明