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    "Ho,CE"的相关文件  

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    显示 17 项.

    类别 日期 题名 作者 档案
    [化學工程與材料工程研究所] 期刊論文 1999 Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system Jain,TA; Huang,CG; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering Ho,CE; Chen,YM; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Formation and resettlement of (AuxNi1-x)Sn-4 in solder joints of ball-grid-array packages with the Au/Ni surface finish Ho,CE; Zheng,R; Luo,GL; Lin,AH; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate Chen,C; Ho,CE; Lin,AH; Luo,GL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Optimizing the wire-bonding parameters for second bonds in ball grid array packages Ho,CE; Chen,C; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Interactions between solder and metallization during long-term aging of advanced microelectronic packages Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering Ho,CE; Tsai,SY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish Liu,CM; Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Selective interfacial reaction between Ni and eutectic BiSn lead-free solder Tao,WH; Chen,C; Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders Chen,WT; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni Ho,CE; Tsai,RY; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints Ho,CE; Shiau,LC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages Shiau,LC; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni Ho,CE; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Chemical reaction in solder joints of microelectronic packages Ho,CE; Lin,YL; Tsai,JY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints Lin,YL; Luo,WC; Lin,YH; Ho,CE; Kao,CR
    [材料科學與工程研究所 ] 期刊論文 2005 Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR

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