中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Items for Author
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 78852/78852 (100%)
Visitors : 35082273      Online Users : 1799
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version

    Category

    Loading community tree, please wait....

    Year

    Loading year class tree, please wait....

    Items for Author "Liu,CY" 

    Return to Browse by Author

    Showing 41 items.

    Collection Date Title Authors Bitstream
    [化學工程與材料工程研究所] 期刊論文 2009 Ag Electromigration Against Electron Flow in Sn5Ag/Cu Solder Bump Tseng,HW; Yeh,YT; Lin,KY; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions Yen,YW; Tseng,HW; Zeng,K; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process Huang,KC; Shieu,FS; Hsiao,YH; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders Hsiao,YH; Tseng,HW; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Reflectivity and Abnormal Absorption at ITO/Al Interface Lin,YH; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2009 Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys Lee,YY; Tseng,HW; Hsiao,YH; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2007 Electromigration-induced Kirkendall voids at the Cu/Cu3Sn interface in flip-chip Cu/Sn/Cu joints Liu,CY; Chen,JT; Chuang,YC; Ke,L; Wang,SJ
    [化學工程與材料工程研究所] 期刊論文 2006 Effect of Cu additives on Sn whisker formation of Sn(Cu) finishes Kao,HJ; Wu,WC; Tsai,ST; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2005 Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization Huang,CP; Chen,C; Liu,CY; Lin,SS; Chen,KH
    [化學工程與材料工程研究所] 期刊論文 2004 An effective Cu-Sn barrier layer for Au bump used in optoelectronic devices Liu,CY; Wang,SJ
    [化學工程與材料工程研究所] 期刊論文 2004 Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps Wang,SJ; Kao,HJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2003 Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization Hsu,SC; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2003 Electromigration studies on Sn(Cu) alloy lines Lu,CC; Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2003 Prevention of spalling by the self-formed reaction barrier layer on controlled collapse chip connections under bump metallization Liu,CY; Wang,SJ
    [化學工程與材料工程研究所] 期刊論文 2003 Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders Wang,SJ; Liu,CY
    [化學工程與材料工程研究所] 期刊論文 2003 Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure Wang,SJ; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2011 A self-formed nanonetwork meshed Pt layer on an epitaxial GaN surface Liu,CY; Chang,CC; Chen,YJ; Chen,PH
    [化學工程與材料工程學系 ] 期刊論文 2011 Abnormal Cu(3)Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates Huang,TS; Tseng,HW; Hsiao,YH; Cheng,CH; Lu,CT; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces Tseng,HW; Lu,CT; Hsiao,YH; Liao,PL; Chuang,YC; Chung,TY; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Fabrication of High-Power InGaN-Based Light-Emitting Diode Chips on Pyramidally Patterned Sapphire Substrate Chen,YJ; Kuo,CH; Tun,CJ; Hsu,SC; Cheng,YJ; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Growth Mechanism of a Ternary (Cu,Ni)(6)Sn(5) Compound at the Sn(Cu)/Ni(P) Interface Huang,TS; Tseng,HW; Lu,CT; Hsiao,YH; Chuang,YC; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Light Output Enhancement of Near UV-LED by Using Ti-Doped ITO Transparent Conducting Layer Lin,YH; Liu,YS; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer Lu,CT; Tseng,HW; Chang,CH; Huang,TS; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers Huang,KC; Shieu,FS; Huang,TS; Lu,CT; Chen,CW; Tseng,HW; Cheng,SL; Liu,CY
    [化學工程與材料工程學系 ] 期刊論文 2010 Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure Liu,CY; Tseng,HW; Song,JM
    [化學學系] 期刊論文 2011 Bortezomib Sensitizes HCC Cells to CS-1008, an Antihuman Death Receptor 5 Antibody, through the Inhibition of CIP2A Chen,KF; Yu,HC; Liu,CY; Chen,HJ; Chen,YC; Hou,DR; Chen,PJ; Cheng,AL
    [化學學系] 期刊論文 2011 Improved exchange reaction in an ionic liquid electrolyte of a quasi-solid-state dye-sensitized solar cell by using 15-crown-5-functionalized MWCNT Huang,KC; Chang,YH; Chen,CY; Liu,CY; Lin,LY; Vittal,R; Wu,CG; Lin,KF; Ho,KC
    [化學學系] 期刊論文 2010 Asymmetric indolylmaleimides as non-dopant type red color emitting dyes Lee,YS; Lin,ZH; Chen,YY; Liu,CY; Chow,TJ
    [化學學系] 期刊論文 2010 CIP2A mediates effects of bortezomib on phospho-Akt and apoptosis in hepatocellular carcinoma cells Chen,KF; Liu,CY; Lin,YC; Yu,HC; Liu,TH; Hou,DR; Chen,PJ; Cheng,AL
    [太空及遙測研究中心] 期刊論文 2009 Seismoionospheric GPS total electron content anomalies observed before the 12 May 2008 M(w)7.9 Wenchuan earthquake Liu,JY; Chen,YI; Chen,CH; Liu,CY; Chen,CY; Nishihashi,M; Li,JZ; Xia,YQ; Oyama,KI; Hattori,K; Lin,CH
    [太空科學研究所 ] 期刊論文 2011 Abnormal infrasound signals before 92 M >= 7.0 worldwide earthquakes during 2002-2008 Xia,YQ; Liu,JYT; Cui,XY; Li,JZ; Chen,WS; Liu,CY
    [太空科學研究所 ] 期刊論文 2011 An integrated study of anomalies observed before four major earthquakes: 2004 Sumatra M9.3, 2006 Pingtung M7.0, 2007 Chuetsu Oki M6.8, and 2008 Wenchuan M8.0 Liu,CY; Liu,JY; Chen,WS; Li,JZ; Xia,YQ; Cui,XY
    [生物醫學工程研究所 ] 期刊論文 2010 Clinical result of sintered bovine hydroxyapatite bone substitute: analysis of the interface reaction between tissue and bone substitute Tsai,WC; Liao,CJ; Wu,CT; Liu,CY; Lin,SC; Young,TH; Wu,SS; Liu,HC
    [光電科學與工程學系] 期刊論文 2005 Fabricating low-loss hollow optical waveguides via amorphous silicon bonding using dilute KOH solvent Lo,SS; Chiu,HK; Chen,CC; Hsu,SC; Liu,CY
    [材料科學與工程研究所 ] 期刊論文 2005 Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes Wei,CC; Liu,CY
    [材料科學與工程研究所 ] 期刊論文 2005 High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure Lin,CL; Wang,SJ; Liu,CY
    [物理研究所] 期刊論文 1998 Clusters of ionization clumps in weakly ionized annular rf discharges Liu,CY; I,L
    [通訊工程研究所] 期刊論文 2009 Blind Beamforming Schemes in SC-FDMA Systems With Insufficient Cyclic Prefix and Carrier Frequency Offset Liu,CY; Chen,YF; Li,CP
    [電機工程研究所] 期刊論文 1996 Variable structure controller design for robust tracking and model following Shyu,KK; Liu,CY
    [電機工程學系] 期刊論文 2010 Extremely High Saturation Current-Bandwidth Product Performance of a Near-Ballistic Uni-Traveling-Carrier Photodiode With a Flip-Chip Bonding Structure Shi,JW; Kuo,FM; Wu,CJ; Chang,CL; Liu,CY; Chen,CY; Chyi,JI
    [環境工程研究所 ] 期刊論文 2001 Effects of the type of sintering atmosphere on the chromium leachability of thermal-treated municipal solid waste incinerator fly ash Wang,KS; Sun,CJ; Liu,CY

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明