English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 83776/83776 (100%)
造访人次 : 61925599      在线人数 : 1127
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻

    子类别

    博碩士論文 [400/400]
    期刊論文 [118/118]
    研究計畫 [184/184]

    社群统计


    近3年内发表的文件: 77(10.97%)
    含全文笔数: 702(100.00%)

    文件下载次数统计
    下载大于0次: 702(100.00%)
    下载大于100次: 670(95.44%)
    全文下载总次数: 396185(0.81%)

    最后更新时间: 2026-01-15 05:11

    上传排行

    数据加载中.....

    下载排行

    数据加载中.....

    RSS Feed RSS Feed
    跳至:
    或输入年份:
    由新到旧排序 由最旧的开始

    显示项目651-700 / 702. (共15页)
    << < 6 7 8 9 10 11 12 13 14 15 > >>
    每页显示[10|25|50]项目

    日期题名作者
    2007-06-29 金、鉑擔載於二氧化鈦上進行光催化甲醇重組產氫之研究; studies on the photocatalytic hydrogen production by methanol reforming over Pt/TiO2 and Au/TiO2 鄭玫玲; Mei-Ling Jheng
    2007-06-28 Alq3昇華下降與生物啟發奈米線; Sublimation point depression and bio-inspired nanowires of Alq3 林明秀; Ming Shiou
    2007-06-27 氧化鈦奈米粒子的合成與表面改質; TiO2 nanoparticle synthesis and surface modification 黃亮維; Liang-wei Huang
    2007-06-27 儲氫材料Mg2Ni生長動力學之研究; Study of intermetallic growth in Mg-Ni diffusion couples 周明弘; Ming-hong Jhou
    2007-06-26 合成高性能直接甲醇燃料電池陽極觸媒關鍵之探討; Key facators to the synthesis of high performance anode catalyst for use in DMFC 陳漢根; Han-Gen Chen
    2007-06-22 以液態電遷移製備鎂基化合物; Fabrication of Mg-based compound by Liquid Electromigration 李卓憲; Cho-hsien Li
    2007-06-21 1M; KOH中Ag-Cu、Ag-Co二元薄膜觸媒對氧還原之催化 Catalytic activity of Ag-Cu and Ag-Co films for oxygen reduction reaction in 1M potassium hydroxide solution 張書維; Shu-Wei Chang
    2007-06-15 不同溫度下微波輻射對矽中氫離子活化效應之研究; The Activated Effects of Hydrogen Ions under Microwave Irradiation at Different Temperature Ambiance 蔡俊璋; Chun-Chang Tsai
    2007 A-B diblock copolymer micelles: Effects of soluble-block length and component compatibility Sheng,Yu-Jane; Wang,Tzu-Yu; Chen,Wei Ming; Tsao,Heng-Kwong
    2007 Ag/Au diffusion wafer bonding for thin-GaN LED fabrication Chang,C. L.; Chuang,Y. C.; Liu,C. Y.
    2007 Amorphous Si/Au wafer bonding Chen,P. H.; Lin,C. L.; Liu,C. Y.
    2007 Coupling effect in Pt/Sn/Cu sandwich solder joint structures Wang,S. J.; Liu,C. Y.
    2007 Dimorphs of sucrose Lee,Tu; Lin,Yu Sheng
    2007 Effects of cross-channel extrusion on the micirostructures and superplasticity of a Zn-22 wt.% Al eutectoid alloy Chou,Cheng-Yu; Lee,Sheng-Long; Lin,Jing-Chie; Hsu,Ching-Miow
    2007 Effects of geometrical characteristics of surface roughness on droplet wetting Sheng,Yu-Jane; Jiang,Shaoyi; Tsao,Heng-Kwong
    2007 Electroless synthesis of pure nickel metal nanotubes using silicon oxide nanowires as removable templates Cheng,S. L.; Hsiao,W. C.
    2007 Fabrication of 2D ordered arrays of cobalt silicide nanodots on (0 0 1)Si substrates (vol 300, pg 473, 2007) Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
    2007 Fabrication of 2D ordered arrays of cobalt silicide nanodots on (001)Si substrates Cheng,S. L.; Lu,S. W.; Wong,S. L.; Chang,C. C.; Chen,H.
    2007 Fabrication of a nanoscale single-crystalline silicon thin film on insulator Lee,T.-H.; Huang,C.-H.; Yang,Y.-Y.; Li,P.-W.; Suryasindhu,T.; Lee,S.
    2007 Fabrication of Mg-based intermetallic compounds by liquid electromigration Li,C. H.; Chuang,Y. C.; Liu,C. Y.
    2007 From superhydrophobic to superhydrophilic surfaces tuned by surfactant solutions Chang,Feng-Ming; Sheng,Yu-Jane; Chen,Hui; Tsao,Heng-Kwong
    2007 High thermally stable Ni/Ag(Al) alloy contacts on p-GaN Chou,C. H.; Lin,C. L.; Chuang,Y. C.; Bor,H. Y.; Liu,C. Y.
    2007 Light emission of sputtered particles induced by ion bombardment on water-enriched molecular ices Lee,Chin Shuang; Ip,Wing; Liu,S. H.; Hsu,G. Y.; Lee,Shyong
    2007 Light enhancement by the formation of an Al oxide honeycomb nanostructure on the n-GaN surface of thin-GaN light-emitting diodes Lin,C. L.; Chen,P. H.; Chan,Chia-Hua; Lee,C. C.; Chen,Chii-Chang; Chang,Jeng-Yang; Liu,C. Y.
    2007 Mass production of Mg2Ni alloy bulk by isothermal evaporation casting process Hsu,Che-Wei; Lee,Sheng-Long; Jeng,Rong-Ruey; Lin,Jing-Chie
    2007 Sublimation point depression of tris(8-hydroxyquinoline)aluminum(III) (Alq3) by crystal engineering Lee,Tu; Lin,Ming Shiou
    2007 The effect of thermomigration on phase coarsening in a eutectic SnPb alloy Chuang,Y. C.; Liu,C. Y.
    2006 Asymmetrical solder microstructure in Ni/Sn/Cu solder joint Wang,S. J.; Liu,C. Y.
    2006 Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading Lin,Chih-Kuang; Teng,Hsuan-Yu
    2006 Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples Chang CW,Lee QP,Ho CE,Kao CR
    2006 Current density dependence of electromigration-induced flip-chip Cu pad consumption Lin,C. T.; Chuang,Y. C.; Wang,S. J.; Liu,C. Y.
    2006 Effect of Fe and Si on properties of squeezed aluminium metal matrix Nd-Fe-B composite magnets Chuang,S. -F.; Lee,S. -L.; Lin,F. -J.; Lin,J. -C.
    2006 Effect of heat treatments on the tensile strength and SCC-resistance of AA7050 in an alkaline saline solution Lin,Jing-Chie; Liao,Hsueh-Lung; Jehng,Wern-Dare; Chang,Chih-Horng; Lee,Sheng-Long
    2006 Effects of limited Cu supply on soldering reactions between SnAgCu and Ni Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS
    2006 Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder Lin CK,Huang CM
    2006 Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR
    2006 Fabrication of periodic nickel silicide nanodot arrays using nanosphere lithography Cheng SL,Lu SW,Li CH,Chang YC,Huang CK,Chen H
    2006 Local melting induced by electromigration in flip-chip solder joints Tsai CM,Lin YL,Tsai JY,Lai YS,Kao CR
    2006 Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates Tsai JY,Chang CW,Ho CE,Lin YL,Kao CR
    2006 Polymorph farming of Acetaminophen and Sulfathiazole on a chip Lee,Tu; Hung,Shi Ting; Kuo,Chung Shin
    2006 Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer Hsiao YH,Chuang YC,Liu CY
    2006 Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps Liu,C. Y.; Ke,Lin; Chuang,Y. C.; Wang,S. J.
    2006 Study of wetting reaction between eutectic AuSn and Au foil Lai YT,Liu CY
    2006 Thermomigration in eutectic SnPb alloy Chuang YC,Liu CY
    2005 Effect of Ag content and heat treatment on the stress corrosion cracking of Al-4.6Cu-0.3Mg alloy Chang,CH; Lee,SL; Lin,JC; Yeh,MS; Jeng,RR
    2005 Effects of Be and Fe on the mechanical and corrosion behaviors of A357 alloys Yang,CY; Lee,SL; Lee,CK; Lin,JC
    2005 Effects of lead and copper particles on corrosion and wear behaviour of Al-Si matrix composites Chuang,SF; Wu,TF; Lee,SL; Kao,CH; Lin,JC; Lee,ZK
    2005 Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes Wei,CC; Liu,CY
    2005 High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure Lin,CL; Wang,SJ; Liu,CY
    2005 In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN

    显示项目651-700 / 702. (共15页)
    << < 6 7 8 9 10 11 12 13 14 15 > >>
    每页显示[10|25|50]项目

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明