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"Kao,CR"的相關文件

類別	日期	題名	作者
[化學工程與材料工程研究所] 期刊論文	2000	Optimizing the wire-bonding parameters for second bonds in ball grid array packages	Ho,CE; Chen,C; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2000	Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate	Chen,C; Ho,CE; Lin,AH; Luo,GL; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2000	Formation and resettlement of (AuxNi1-x)Sn-4 in solder joints of ball-grid-array packages with the Au/Ni surface finish	Ho,CE; Zheng,R; Luo,GL; Lin,AH; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2001	Special issue on lead-free solder materials and soldering technologies - Foreword	Kang,SK; Mavoori,H; Chada,S; Kao,CR; Smith,RW
[化學工程與材料工程研究所] 期刊論文	2001	Selective interfacial reaction between Ni and eutectic BiSn lead-free solder	Tao,WH; Chen,C; Ho,CE; Chen,WT; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2001	Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish	Liu,CM; Ho,CE; Chen,WT; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2001	Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering	Ho,CE; Tsai,SY; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2001	Interactions between solder and metallization during long-term aging of advanced microelectronic packages	Ho,CE; Chen,WT; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2002	Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni	Ho,CE; Lin,YL; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2002	Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages	Shiau,LC; Ho,CE; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2002	Phase diagrams of important electronic materials	Kao,CR
[化學工程與材料工程研究所] 期刊論文	2002	Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints	Ho,CE; Shiau,LC; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2002	Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni	Ho,CE; Tsai,RY; Lin,YL; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2002	Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders	Chen,WT; Ho,CE; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2003	Special issue on phase stability, phase transformations, and reactive phase formation in electronic materials - Foreword	Chen,SW; Lee,HM; Swenson,D; Kao,CR; Mohney,SE; Notis,MR; Schmid-Fetzer,R
[化學工程與材料工程研究所] 期刊論文	2003	Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword	Lucas,JP; Chada,S; Kang,SK; Kao,CR; Lin,KL; Ready,J; Yu,J
[化學工程與材料工程研究所] 期刊論文	2003	Recent progress in phase diagram calculation and application	Kao,CR
[化學工程與材料工程研究所] 期刊論文	2003	Electromigration failure in flip chip solder joints due to rapid dissolution of copper	Hu,YC; Lin,YH; Kao,CR; Tu,KN
[化學工程與材料工程研究所] 期刊論文	2003	Chemical reaction in solder joints of microelectronic packages	Ho,CE; Lin,YL; Tsai,JY; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2003	A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni	Tsai,JY; Hu,YC; Tsai,CM; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2004	Special issue on Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III - Foreword	Kao,CR; Chen,SW; Lee,HM; Mohney,SE; Notis,MR; Swenson,DJ
[化學工程與材料工程研究所] 期刊論文	2004	Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction	Wu,AT; Tu,KN; Lloyd,JR; Tamura,N; Valek,BC; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2004	Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints	Lin,YL; Luo,WC; Lin,YH; Ho,CE; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2004	Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints	Tsai,CM; Luo,WC; Chang,CW; Shieh,YC; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration-induced grain rotation in anisotropic conducting beta tin	Wu,AT; Gusak,AM; Tu,KN; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration-induced failure in flip-chip solder joints	Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2005	Electromigration induced metal dissolution in flip-chip solder joints	Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Tsai,JY; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2005	Controlling the microstructures from the gold-tin reaction	Tsai,JY; Chang,CW; Shieh,YC; Hu,YC; Kao,CR
[材料科學與工程研究所 ] 期刊論文	2005	Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations	Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR
[材料科學與工程研究所 ] 期刊論文	2005	In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing	Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN
[化學工程與材料工程研究所] 期刊論文	1996	On the relationships between the self-diffusion parameters and the thermodynamic properties in B2 intermetallic compounds	Kao,CR
[化學工程與材料工程研究所] 期刊論文	1996	A mechanism for reactive diffusion between Si single crystal and NbC powder compact	Kao,CR; Woodford,J; Chang,YA
[化學工程與材料工程研究所] 期刊論文	1997	Reactions of solid copper with pure liquid tin and liquid tin saturated with copper	Hayashi,A; Kao,CR; Chang,YA
[化學工程與材料工程研究所] 期刊論文	1997	Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples	Kao,CR
[化學工程與材料工程研究所] 期刊論文	1997	Calculation of low-temperature phase equilibria in the indium-lead system	Kao,CR
[化學工程與材料工程研究所] 期刊論文	1998	Phase equilibria of the Si-Ge-Ti system relevant to the reactions between SiGe alloys and Ti	Jain,TA; Kao,CR
[化學工程與材料工程研究所] 期刊論文	1999	Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallization	Chen,CP; Lin,CF; Swenson,D; Kao,CR; Jan,CH; Chang,YA
[化學工程與材料工程研究所] 期刊論文	1999	Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering	Ho,CE; Chen,YM; Kao,CR
[化學工程與材料工程研究所] 期刊論文	1999	Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system	Jain,TA; Huang,CG; Ho,CE; Kao,CR
[化學工程與材料工程研究所] 期刊論文	1999	Interfacial reactions between Ni substrate and the component Bi in solders	Lee,MS; Liu,CM; Kao,CR
[化學工程與材料工程研究所] 期刊論文	1999	Formation and absence of intermetallic compounds during solid-state reactions in the Ni-Bi system	Lee,MS; Chen,C; Kao,CR
[化學工程與材料工程研究所] 期刊論文	1999	Binary compounds in the Ge-Ti system	Jain,TA; Kao,CR
[化學工程與材料工程研究所] 期刊論文	2009	Special Issue: 2009 Pb-Free Solders - Foreword	Kang,SK; Anderson,I; Chada,S; Duh,JG; Turbini,LJ; Wu,A; Kao,CR; Hua,F; Subramanian,KN; Frear,D; Handwerker,C; Guo,F; Chawla,N; Zeng,KJ

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